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The Weiss Technik Shock Event Temperature Shock Test Chamber allows for the testing of the functionality and reliability of electronic products and their components against alternating low and high temperatures. As opposed to standard temperature testing, our thermal cycling chamber produces extremely fast temperature changes from -80°C to +220°C, highlighting latent weak points and helping you to reduce early failures and to increase the reliability of your products.
We know what matters for your tests: reliable, precise and reproducible tests. We bear this in mind when designing our test chambers, relying on our comprehensive expertise and years of experience to eliminate any interfering factors during the design phase. We use only high quality materials and have regular quality checks in place throughout the entire production process to ensure we’re providing you with a high quality temperature test chamber.
Environmental conditions have a great effect on the functionality and reliability of electronic components, devices, and systems. In order to discover latent weaknesses in the shortest possible time, a typical temperature test is often insufficient; test specimens must be subjected to multiple, abrupt temperature changes.
With our ShockEvent series, extremely fast temperature changes ranging from -80 °C to +220 °C can be realised. For this purpose, we offer solutions in the form of the damper shock test chamber, with stationary test space and including the ambient temperature for 3-zone tests, or the classic vertical shock test chamber equipped with a mobile lifting cage. As a result, you can reduce early failures and increase the reliability of your products.
You can find out more about our range of ShockEvent chambers by downloading the brochure here.